By Wu Siya

 

BEIJING, Nov. 20 (China Economic Net)- "Since the beginning of this year, global semiconductor sales have gradually emerged from the downward cycle, ushering in new opportunities. However, in terms of the international environment and industrial upgrade, many changes and challenges still lie ahead," Chen Nanxiang, chairman of the China Semiconductor Industry Association, analyzed at the recently concluded 21st China International Semiconductor Expo (IC China 2024).

 

In the third quarter of 2024, global semiconductor sales reached USD 166 billion, the highest level since 2016, with the Chinese market sales contributed USD 46.75 billion, an increase of 20.6% year-on-year, providing indispensable support to the global semiconductor industry. However, the global materials market remains dominated by Japanese manufacturers. Facing the significant challenge of localization, Chinese manufacturers are also setting off a revolution.

 

 

"This is our cutting-edge product," domestic semiconductor leader CR Micro shows a 12-inch wafer. Being a basic material in the manufacturing of semiconductor integrated circuits, wafer is called "blood". "In this day and age, China is constantly breaking through in the field of wafer manufacturing. We are also accelerating the layout of third-generation semiconductor, especially the power semiconductor devices using silicon carbide (SiC) and gallium nitride (GaN)," a staff told China Economic Net reporter.

 

Dependence on imports has long been the biggest bottleneck restricting the development of China’s semiconductor industry. After years of localization, the materials for large silicon wafers, the third-generation semiconductor, high-purity electronic chemicals, and abrasives have gradually realized independent supply.

 

"Localization is a key factor in boosting the continuous growth of the Chinese semiconductor material market in the next few years." Another leading manufacturer Konfoong Materials International showed the advanced materials and components such as ultra-high-pure metal targets. "KFMI has filled a gap, prompting China’s ultra-high pure metal materials and sputtering targets to no longer rely on imports," a person in charge introduced.

 

 

Other than advanced materials, semiconductor-related production equipment also attracted much attention. "This 12/8 -inch full-automatic double-axis wafer cutting machine is mainly used for 12-inch wafer cutting, with our accuracy is within 3 microns," General Manager of Guangdong Quadro Semiconductor Equipment, noted. "Now the production rate of the entire packaging equipment field is relatively low. The localization rate of the industry where this equipment is located is still only 3%, and 97%must rely on imports. After several years of R&D and iteration, the various technical indicators of this cutting machine have reached the international advanced level and have large-scale commercial conditions."